I-Thermalright LGA1700-BCF/AMD-ASF CPU Ukugoba isiLungiso sokuLungisa iBuckle CNC iAluminiyam iAluminiyam ye-Intel Gen 12/AMD RYZEN 7000 CPU

Inkcazelo emfutshane:

I-Thermalright LGA1700-BCF/AMD-ASF CPU Isilungiso sokugoba iBuckle eFixed Buckle CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU
kuba Intel 12th isizukulwana CPU
Inkcazo:
Igama: CPU Anti-Bending isakhelo
Izinto eziphathekayo: i-aluminium alloy
Umbala: mnyama, ngwevu, bomvu, bhlowu (ukhetho)
Isebenza: Ukubonelela kuphela ngenkxaso ye-Intel 12th isizukulwana CPU, i-motherboard CPU socket yi-LGA1700, kunye ne-chipset yi-H610 B660 Z690 series.
Ubukhulu: Ubude 54mm Ububanzi 70mm Ukuphakama 6mm
Ubunzima: umzimba oyintloko 20g; iyonke 50g
Ingcaciso yeMveliso:
I-Thermalright yenza isisombululo esichasene nokugoba kwiiprosesa ze-Intel's Alder Lake
Kuba abaqhubekekisi be-Intel's Alder Lake batyekele ekuguquguqukeni nasekujikeni, isiphene kunye ne-Intel LGA1700 CPU's latching system. Ukuphendula kule ngxaki, "isakhelo esichasene ne-bend" saphuhliswa, senzelwe ukuthintela ukulwa / ukugoba kwe-Alder Lake CPUs.
I-LGA1700-BCF, isakhelo se-aluminiyam esithatha indawo ye-CPU yokufaka indlela ye-LGA1700 CPU socket yenkampani. Esi sakhelo singena malunga neprosesa kwaye ikhuselwe ngezikrufu ezilula. Isakhelo sisebenza ngakumbi uxinzelelo kwiiprosesa ze-Intel's Alder Lake, ukunciphisa ithuba lokulwa. Nangona kunjalo, kuba i-Intel ilumkisa ukuba esi sisombululo sinyukayo sinokukhupha iwaranti yakho ye-CPU, ke abathengi kufuneka baqonde oku.
Le LGA 1700 Anti-Bend Buckle ithatha yonke-aluminiyam ye-CNC yegolide ye-anodized sandblasting inkqubo, kunye nobukhulu obupheleleyo be-70 x 54 x 6 mm kunye nobunzima obuyi-50g. Ukuma kwayo okuchanekileyo kunokunqanda i-capacitors kwi-motherboard, kwaye isebenzisa i-LOTES yasekuqaleni yokukhusela i-pads yokukhusela, kwaye ikwabonelela ngemibala eyahlukeneyo.
Xa kuthelekiswa nezibiyeli ezenziwe ekhaya zangaphambili, le LGA 1700 anti-goba buckle ibanzi ngakumbi kuyilo kunye nomgangatho ongcono. Ngaphezu koko, ixabiso lifikeleleka kakhulu. Z690, B660 kunye ne-H610 motherboards zingasebenzisa le LGA 1700 anti-bending clip
Uphawu:
1. Ukuthelekisa: Xa kuthelekiswa nezinye iimveliso ezifanayo, le mveliso isebenzisa i-flat flat side ezine endaweni yoxinzelelo lwamanqaku amaninzi, ngokubeka ngokuchanekileyo, ukuphepha i-capacitance, ehambelana nokulungiswa kwe-CPU;
2. I-pad yokukhusela i-insulation: Indawo yokudibanisa kunye nebhodi ephambili iphantsi kwe-flat, kwaye i-LOTES yokukhusela i-pad yokukhusela i-pad yenkcazo efanayo isetyenziselwa ukunciphisa uxinzelelo kwibhodi ephambili kunye nokunciphisa ngakumbi ukuphazamiseka komqondiso;
3. Ukuphazamiseka kweSignali: Umphezulu wesinyithi uphakanyiselwa ukunciphisa ukuphazamiseka kwesignali kwicala le-motherboard;
4. Izinto ezibonakalayo: Esi sixhobo se-CPU se-orthotic sinemibala emibini: emnyama kunye nebomvu. Yenziwe ngesanti ye-anodized eqhuma yonke i-aluminium alloy CNC precision machining, isebenzisa i-original insulation pad yerabha, kwaye igxininiswe ngezikrufu zesokethi ze-hexagonal. Kulula ukuyifaka kwaye inokunciphisa ukungena kwegrisi ye-silicone kumda we-CPU;
5. Inkcazo: Ngenxa yoyilo lwe-AMD Ryzen 7000 “emilo ekhethekileyo” ye-CPU yesigqubuthelo esiphezulu, xa ufaka i-radiator, ngenxa yoxinzelelo lofakelo, kuya kubakho igrisi ye-silicone ekhutshiweyo ye-thermal conductive, eya kuthi iqokelele kwi-Gap. i-AMD Ryzen 7000 CPU, enokuba nzima ukuyisusa, okanye ivuze kwi-capacitor, enokuthi ibeke ingozi yokhuseleko.
ye-AMD RYZEN 7000
Imvelaphi: i-Mainland China
Inombolo yoMfanekiso: I-CPU Bracket
Uhlobo: Umphathi we-CPU
Umbala: Mnyama, obomvu (ukhetho)
Iipropati: Akukho grisi ye-silicone, kunye negrisi ye-silicone (ukhetho)
Izinto eziphathekayo: I-aluminium alloy
Inkqubo: CNC anode sanding
Ukulungisa izixhobo: L-uhlobo screwdriver
Ubungakanani: 70x54x6mm/2.76×2.13×0.24in
Ubunzima: Umzimba 20g, iyonke 55g
Inkqubo yokuhlohla:
1. Beka i-motherboard ngokuthe tye kwi-desktop kwaye uvule ikliphu ye-CPU
2. Sebenzisa i-screwdriver ye-T20 Torx eqhotyoshelweyo ukususa indawo ephezulu kwaye ubeke i-fastener esezantsi ecaleni.
3. Faka i-CPU ngaphakathi
4. Gquma i-snap ephuculweyo kwi-CPU engaphezulu kwaye uyishukumise ngobunono ide icofe endaweni
5. Qinisa izikrufu kwi-engile echaseneyo ngesiqingatha sokujika. Isikrufu ngasinye sithatha isiqingatha somjikelo ngokulandelelana kwediagonal de sikrwelwe, siyakubeka uxinzelelo kwi-CPU ngokungalinganiyo
Phawula:
Ngaphandle kwegrisi ye-thermal.
Ngenxa yeemonitha ezahlukeneyo kunye nesiphumo sokukhanya, owona mbala wento unokwahluka kancinane kumbala oboniswe kwimifanekiso. Enkosi!
Nceda uvumele i-1-2cm inxaxha ngenxa yomlinganiselo owenziwe ngesandla.
ipakethe
I-1X ye-Anti-Bend Frame Kit
I-screwdriver ye-1X engu-L